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| Prepared Checked Approved Product Specifications Ref No. Total Page Page No. C-1 9 3 AN17831A Description of Test Circuits and Test Methods [Test Circuit 1] AN17831A 1 Vcc 2 3 4 10 5 + 51k 20k 6 7 8 33 9 + 10 11 V out2 RL 4 12 + V out1 RL 4 2200 8.2k 20k STB ON OFF Vin1 5V Vin2 OFF MUTE ON 3V Note : * STB 'OFF' means 5V . MUTE 'OFF' means 0V . Eff. Date 18-FEB-2002 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 Rev.1 Prepared Checked Approved Product Specifications Ref No. Total Page Page No. D-1 9 4 AN17831A Circuit Function Block Diagram REF MUTE Standby Circuit - 1 2 3 4 Pin Descriptions Pin No. 1 2 3 4 5 6 Pin Descriptions Vcc Ch1 +ve Phase Output Ch1 Output GND Ch1 -ve Phase Output Standby Ch1 Input Pin No. 7 8 9 10 11 12 Pin Descriptions Pre GND Ch2 Input Mute Ch2 -ve Phase Output Ch2 Output GND Ch2 +ve Phase Output Eff. Date 18-FEB-2002 Eff. Date Eff. Date FMSC-PSDA-002-01 Rev.1 + + 5 6 7 8 9 10 Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. + + - + + - Protection Circuit Thermal Shutdown Load Short Vcc Short Ground Short ASO Protect 11 12 Prepared Checked Approved Product Specifications Ref No. Total Page Page No. E 9 5 AN17831A Package Name Unit : mm FP-12S 3.6 6.4 0.3 7.7 0.3 12 7.8 0.3 29.96 0.3 28.0 0.3 20.00.1 0.6 R1.8 1 1.2 0.1 +0.1 0.25 -0.05 2.54 0.6 0.1 3.5 0.3 Eff. Date 18-FEB-2002 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 Rev.1 29.6 0.3 Name of item Date Code Company insignia Prepared Checked Approved Product Specifications Ref No. Total Page Page No. F-1 9 6 AN17831A SiN, Fe group, Ag plating, PSG, Cu group, Au plating, (Structure Description) Chip surface passivation Lead frame material Inner lead surface process Outer lead surface process Chip mounting method Wire bonding method Mold material Molding method Fin material Others ( Others ( Others ( Others ( ) ) ) ) ) ) ) ) ) 1 2, 6 2 6 3 4 4 5 5 Solder plating, Solder dip, Ag paste, Au-Si alloy, Solder, Others ( Others ( Others ( Others ( Others ( Thermalsonic bonding, Epoxy, Transfer mold, Multiplunger mold, Cu Group Package FP-12S 1 4 3 5 6 2 Eff. Date 18-FEB-2002 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 Rev.1 Prepared Checked Approved Product Specifications Ref No. Total Page Page No. G-1 9 7 AN17831A Application Circuit VCC 12V Input GND VCC 2200 7 1 OUT1 40dB 2 3 Output1 GND RL 4 IN 1 6 51k STB 40dB 4 5 10 STB Vref MUTE 8.2k OUT1 MUTE 9 33 40dB 10 11 OUT2 Output2 GND IN 2 8 40dB RL 4 12 OUT2 STB 'OFF' STB 'ON' Mute 'OFF' Mute 'ON' Eff. Date 18-FEB-2002 FMSC-PSDA-002-01 Rev.1 5V 0V 0V 3V Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. Eff. Date Prepared Checked Approved Product Specifications Ref No. Total Page Page No. G-2 9 8 AN17831A (1) Tc = Ta, 62.5W ( j-c = 2 C/W ) (2) 20.83W ( f = 4.0 C/W ) PD - T Curves a With a 100cm 2X 3mm Al heat sink (black colour coated) or a 200cm 2X 2mm Al heat sink (not lacquered) (3) 15.63W ( f = 6.0 C/W ) With a 100cm X 2mm Al heat sink (not lacquered) (4) 3.0W at Ta = 25C ( j-a = 42C/W ) 2 80 Without heat sink 70 62.5W 60 Power Dissipation PD ( W ) (1) 50 40 30 20.8W 15.6W 20 10 (2) (3) 3.0W (4) 0 0 25 50 75 100 125 150 Ambient Temperature Ta ( C ) Eff. Date 18-FEB-2002 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 Rev. 1 Prepared Checked Approved Product Specifications Ref No. Total Page Page No. H-1 9 9 AN17831A (Precautions for use) 1) Be sure to attach a heat sink to the IC before use. Make sure that the heat sink is secured to the chassis. 2) Ground the radiation fin so that there will be no difference in electric potential between the radiation fin and ground. 3) The thermal protection circuit operates at a Tj of approximately 150C. The thermal protection circuit is reset automatically when the temperature drops. 4) The overvoltage protection circuit operates at a Vcc of approximately 28V. 5) Use a stabilised power supply with a 3V or higher standby voltage. Eff. Date 18-FEB-2002 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 Rev1. |
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